Electronic Potting Compound

Introduction

Electronic potting compounds 

are protective materials used to encapsulate and seal electronic components, providing superior electrical insulation, mechanical strength, and environmental resistance.

They are widely applied in PCB potting, power modules, sensors, and control units, where stable performance and long-term reliability are essential.

Our range includes silicone potting compounds, epoxy resin potting compounds, and polyurethane potting compounds — each formulated for different protection needs.

From flexible silicone potting for temperature stability, to tough epoxy encapsulation for structural strength, and polyurethane potting for balanced protection — we offer complete electrical potting solutions for demanding applications in automotive, industrial, and consumer electronics.

Product Name Mixed Viscosity Pot life Shore Hardness Max operating temperature Thermal conductivity
SikaBiresin RE263 Polyurethane Potting Compound
SikaBiresin RE263
1700 mPa.s 11 min A 26 100 °C 0.2 W/m.K
SikaBiresin RE323 Polyurethane Potting Compound
SikaBiresin RE323
1700 mPa.s 14 min A 33 100 °C 0.2 W/m.K
SikaBiresin RE401 Polyurethane Potting Compound
SikaBiresin RE401
2400 mPa.s 60 min A 90 120 °C 0.7 W/m.K
SikaBiresin RE451A Polyurethane Potting Compound
SikaBiresin RE451A
2150 mPa.s 50 min A 47 115 °C 0.4 W/m.K
SikaBiresin RE461 Polyurethane Potting Compound
SikaBiresin RE461
1100 mPa.s 10-50 min D 46 120 °C 0.7 W/m.K
SikaBiresin RE500 Polyurethane Potting Compound
SikaBiresin RE500
2600 mPa.s 30 min D 50 120 °C 0.6 W/m.K
SikaBiresin RE501A Polyurethane Potting Compound
SikaBiresin RE501A
2200 mPa.s 55 min A 57 130 °C 0.3 W/m.K
SikaBiresin RE531 Polyurethane Potting Compound
SikaBiresin RE531
1650 mPa.s 22 min D 53 160 °C 0.73 W/m.K
SikaBiresin RE550 Polyurethane Potting Compound
SikaBiresin RE550
500 mPa.s 2 min A 55 120 °C 0.25 W/m.K
SikaBiresin RE551 Polyurethane Potting Compound
SikaBiresin RE551
2400 mPa.s 30-60 min D 57 130 °C 0.73 W/m.K
SikaBiresin RE560 Polyurethane Potting Compound
SikaBiresin RE560
1300 mPa.s 25-50 min D 56 120 °C 0.32 W/m.K
SikaBiresin RE602 Polyurethane Potting Compound
SikaBiresin RE602
Thixotropy 7 min D 57 110 °C 0.3 W/m.K
SikaBiresin RE650 Polyurethane Potting Compound
SikaBiresin RE650
1100 mPa.s 70 min A 68 120 °C 0.22 W/m.K
SikaBiresin RE651 Polyurethane Potting Compound
SikaBiresin RE651
1,900 mPa.s 30-50 min D 67 130 °C 0.63 W/m.K
SikaBiresin RE700 Polyurethane Potting Compound
SikaBiresin RE700
200 mPa.s 30 min A 70 80 °C 0.2 W/m.K
SikaBiresin RE750 Polyurethane Potting Compound
SikaBiresin RE750
5,000 mPa.s 30 min D 83 130 °C 0.45 W/m.K
SikaBiresin RE800 Polyurethane Potting Compound
SikaBiresin RE800
1,200 mPa.s 65 min D 80 120 °C 0.35 W/m.K
SikaBiresin RE812 Polyurethane Potting Compound
SikaBiresin RE812
5,700 mPa.s 2 min D 81 130 °C 0.45 W/m.K
SikaBiresin RE820 Polyurethane Potting Compound
SikaBiresin RE820
4300 mPa.s 10-50 min A 82 120 °C 0.25 W/m.K
SikaBiresin RE830 Polyurethane Potting Compound
SikaBiresin RE830
1,200 mPa.s 30 min D 83 130 °C 0.45 W/m.K
SikaBiresin RE840 Polyurethane Potting Compound
SikaBiresin RE840
800 mPa.s 30 min D 86 130 °C 0.65 W/m.K
SikaBiresin RE851 Polyurethane Potting Compound
SikaBiresin RE851
3,800 mPa.s 10 min D 85 130 °C 0.75 W/m.K
SikaBiresin RE880 Polyurethane Potting Compound
SikaBiresin RE880
1500 mPa.s 40 min A 88 130 °C 0.34 W/m.K
SikaBiresin RE885 Polyurethane Potting Compound
SikaBiresin RE885
1,900 mPa.s 13-30 min D 88 150 °C 0.42 W/m.K
Product Name Mixed Viscosity Pot life Shore Hardness Max operating temperature Thermal conductivity
8250 Epoxy Potting Adhesive
8250
- 4H D 75~80 - -
SikaBiresin RE801 Epoxy Resin Potting Compound
SikaBiresin RE801
3,500 mPa.s 55 min D80 130℃ 0.6 W/m.K
SikaBiresin RE833 Epoxy Resin Potting Compound
SikaBiresin RE833
1,100 mPa.s 250 min / 80℃ D 84 180℃ 0.2 W/m.K
SikaBiresin RE891 Epoxy Resin Potting Compound
SikaBiresin RE891
3,000 mPa.s 220 min D 88 160℃ 0.65 W/m.K
SikaBiresin RE896 Epoxy Resin Potting Compound
SikaBiresin RE896
- 60 min / 70℃ D 90 180℃ 1 W/m.K
SikaBiresin RE915 Epoxy Resin Potting Compound
SikaBiresin RE915
60000 mPa.s 19 min / 120 ℃ D 91 150℃ 0.6 W/m.K
Product Name Mixed Viscosity Pot life Shore Hardness Max operating temperature Thermal conductivity
SikaBiresin TC414 Silicone Potting Compound
SikaBiresin TC414
170,000 mPa.s 30 min 00 55 -50 ~ 200℃ 2.0 W/m.K
Sikasil 942 LH Silicone Potting Compound
Sikasil 942 LH
13,000 mPa.s 60 min A 20 -50 ~ 200℃ 2.5 W/m.K
Sikasil 951 TC2 Silicone Potting Compound
Sikasil 951 TC2
6,000 mPa.s 60 min 00 55 -50 ~ 200℃ 2.0 W/m.K
Sikasil 952 TC Silicone Potting Compound
Sikasil 952 TC
1,200 mPa.s 120-5000 min 00 15 -50 ~ 200℃ 1.2 W/m.K
Sikasil 953 Silicone Potting Compound
Sikasil 953
6,000 mPa.s 120 min A 50 -50 ~ 200℃ 0.6 W/m.K
Sikasil 975 TC3 Silicone Potting Compound
Sikasil 975 TC3
120,000 mPa.s 30 min 00 55 -50 ~ 200℃ 3.0 W/m.K

Potting Material Properties

Each electronic potting compound offers distinct performance for electrical potting and potting encapsulation. Understanding silicone, epoxy, and polyurethane options helps you balance electrical insulation, mechanical strength, and environmental protection in PCB potting and other assemblies.

Silicone Potting Compound

Silicone potting compounds deliver excellent thermal stability, flexibility, and moisture resistance, ideal for PCB potting, sensors, and LED modules. They maintain reliable electrical insulation under high heat and humidity, providing durable electronic potting silicone protection.

  • Key properties: high flexibility, wide temperature range, weather resistance

  • Typical applications: automotive sensors, outdoor electronics, power supplies

Epoxy Resin Potting Compound

Epoxy resin potting compounds provide superior mechanical strength, chemical resistance, and adhesion to metals and plastics. They cure to a rigid body for robust potting encapsulation, protecting against vibration, corrosion, and electrical failure—ideal for power electronics and industrial modules.

  • Key properties: high hardness, strong adhesion, outstanding dielectric strength

  • Typical applications: transformers, automotive ECUs, high-voltage assemblies

Polyurethane Potting Compound

Polyurethane potting compounds combine moderate flexibility with excellent shock and vibration resistance. They offer balanced protection for delicate circuits while maintaining strong insulation, making them a versatile choice for diverse electronic potting needs.

  • Key properties: elastic yet durable, impact absorption, good moisture sealing

  • Typical applications: LED drivers, connectors, consumer and industrial electronics

Benefits of Electronic Potting

Electronic potting compounds play a vital role in protecting and improving the performance of electronic components. They help ensure long-term reliability by providing environmental protection, mechanical strength, electrical insulation, and thermal management. Below are the key benefits that potting materials bring to modern electronic designs.

1. Protection from Moisture, Dust, and Corrosion

Potting encapsulation forms a durable barrier that seals components against moisture, dust, and corrosive elements. This protection prevents oxidation and contamination, ensuring stable performance even in harsh or outdoor environments.

2. Increased Durability and Impact Resistance

By reinforcing mechanical stability, electronic potting compounds absorb vibration and mechanical shock, protecting delicate circuits from physical stress. This enhanced strength extends the service life of electronic devices and maintains consistent reliability under demanding operating conditions.

3. Electrical Insulation for High-Voltage Safety

Potting materials offer excellent electrical insulation, effectively preventing short circuits and electrical leakage in high-voltage applications. This ensures operational safety and protects users and equipment from electrical failure.

4. Thermal Conductivity and Heat Dissipation

Thermally conductive potting compounds help manage heat generated by electronic components. By improving heat dissipation, they prevent overheating, enhance efficiency, and extend the performance stability of the entire system.